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1.
公开(公告)号:US08334160B2
公开(公告)日:2012-12-18
申请号:US11865600
申请日:2007-10-01
申请人: Brite Jui-Hsien Wang , Naejye Hwang , Zingway Pei
发明人: Brite Jui-Hsien Wang , Naejye Hwang , Zingway Pei
IPC分类号: H01L21/00
CPC分类号: H01L31/0475 , H01L31/022466 , H01L31/02363 , H01L31/0693 , H01L31/184 , H01L31/1884 , Y02E10/544 , Y02P70/521
摘要: A semiconductor photovoltaic device comprises a semiconductor substrate having a first surface and a second surface, the first surface and the second surface being opposed to each other, a plurality of trenches extending into the semiconductor substrate from the first surface, the first surface being a substantially planar surface, a dopant region in the semiconductor substrate near the first surface and the plurality of trenches, a first conductive layer over the semiconductor substrate, and a second conductive layer on the second surface of the semiconductor substrate.
摘要翻译: 半导体光伏器件包括具有第一表面和第二表面的半导体衬底,第一表面和第二表面彼此相对,从第一表面延伸到半导体衬底中的多个沟槽,第一表面基本上 在第一表面和多个沟槽附近的半导体衬底中的掺杂剂区域,半导体衬底上的第一导电层以及半导体衬底的第二表面上的第二导电层。
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2.
公开(公告)号:US20090084440A1
公开(公告)日:2009-04-02
申请号:US11865600
申请日:2007-10-01
申请人: Brite Jui-Hsien WANG , Naejye HWANG , Zingway PEI
发明人: Brite Jui-Hsien WANG , Naejye HWANG , Zingway PEI
IPC分类号: H01L31/032 , H01L31/04 , H01L31/18
CPC分类号: H01L31/0475 , H01L31/022466 , H01L31/02363 , H01L31/0693 , H01L31/184 , H01L31/1884 , Y02E10/544 , Y02P70/521
摘要: A semiconductor photovoltaic device comprises a semiconductor substrate having a first surface and a second surface, the first surface and the second surface being opposed to each other, a plurality of trenches extending into the semiconductor substrate from the first surface, the first surface being a substantially planar surface, a dopant region in the semiconductor substrate near the first surface and the plurality of trenches, a first conductive layer over the semiconductor substrate, and a second conductive layer on the second surface of the semiconductor substrate.
摘要翻译: 半导体光伏器件包括具有第一表面和第二表面的半导体衬底,第一表面和第二表面彼此相对,从第一表面延伸到半导体衬底中的多个沟槽,第一表面基本上 在第一表面和多个沟槽附近的半导体衬底中的掺杂剂区域,半导体衬底上的第一导电层以及半导体衬底的第二表面上的第二导电层。
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