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公开(公告)号:US20200251355A1
公开(公告)日:2020-08-06
申请号:US16757497
申请日:2018-10-23
Applicant: 1366 TECHNOLOGIES, INC.
Inventor: Robertus Antonius STEEMAN
IPC: H01L21/673 , H01L21/677 , H01L31/0352 , H01L31/18 , B65G47/90
Abstract: A semiconductor wafer is as wide as the industry standard width A (presently 156 mm+/−1 mm) and is longer than the industry standard A by at least 1 mm and as much as the standard equipment can reasonably accommodate, presently approximately 3-20 mm and potentially longer, thus, gaining significant additional surface area for sunlight absorption. Modules may be composed of a plurality of such larger wafers. Such wafers can be processed in conventional processing equipment that has a wafer retaining portion of industry standard size A and a configuration that also accommodates a wafer with a perpendicular second edge longer than A by at least 1 and typically 3-20 mm. Wet bench carriers and transport and inspection stations can be so used.