公开(公告)号：US20180370205A1

公开(公告)日：2018-12-27

申请号：US16064657

申请日：2016-12-22

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Przemyslaw P. Markowicz ,  Neeraj Sharma ,  Jeremy K. Larsen ,  Jeffrey O. Emslander ,  Jung-Sheng Wu ,  Richard G. Anderson ,  Frank C. Piras

IPC: B32B27/20 ,  B32B27/32 ,  B32B7/12 ,  C08K3/22 ,  C08K3/34 ,  B23K26/18

Abstract: Provided are adhesive-backed films and related methods useful in laser cutting a substrate protected by an adhesive-backed film. The adhesive-backed film includes a base layer comprised of a polymer and having opposing first and second major surfaces and an adhesive layer comprising a pressure-sensitive adhesive directly or indirectly coupled to the second major surface. An infrared absorber is present in one or both of the polymer and the pressure-sensitive adhesive, and the adhesive-backed film is sufficiently transparent to enable visual inspection of a surface having the adhesive-backed film disposed thereon.