公开(公告)号：US20250043159A1

公开(公告)日：2025-02-06

申请号：US18714865

申请日：2022-12-12

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Junbeom Shin ,  Jeongwan Choi ,  Jong-Pil Kim

IPC: C09J9/02 ,  C08K3/08 ,  C09J7/21

Abstract: The disclosure relates to an electrically conductive bonding tape and an electronic device including the same. Specifically, according to an embodiment of the disclosure, there is provided an electrically conductive bonding tape, including an electrically conductive first adhesive layer including opposing first and second major surfaces and electrically conductive along at least a thickness direction, the first adhesive layer having an average thickness t and including a substantially electrically insulative first adhesive material and pluralities of electrically conductive first and second particles dispersed in the first adhesive material, the first and second particles having respective average thickness t1 and t2, t1/t being 0.7-0.95 inclusive, t2/t being 0.2-0.7 inclusive.

公开(公告)号：US20240084176A1

公开(公告)日：2024-03-14

申请号：US18239887

申请日：2023-08-30

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Junbeom Shin ,  Jeongwan Choi ,  Jong-Pil Kim

IPC: C09J9/02 ,  C09J5/00 ,  C09J7/21 ,  H01B5/00 ,  H05K3/20

CPC classification number: C09J9/02 ,  C09J5/00 ,  C09J7/21 ,  H01B5/00 ,  H05K3/20 ,  C09J2203/326 ,  C09J2301/1242 ,  C09J2301/408 ,  C09J2400/166

Abstract: An electrically conductive bonding tape includes a conductive first film between, and bonded to, conductive first and second adhesive layers. The first film and the first and second adhesive layers are conductive at least along a thickness direction of the bonding tape. Each of the first and second adhesive layers includes conductive particles dispersed substantially as a single layer in a substantially insulative adhesive material. The plurality of conductive particles in each of the first and second adhesive layers has an average particle size Pav and a standard of deviation Psd, such that Psd/Pav is less than about 0.2. Each of the first and second adhesive layers has an average thickness of no more than about 15% greater than the average particle size of the particles in the adhesive layer. An average surface roughness of opposing major first and second surfaces of the first film is less than 10 microns.