HIGH-VOLTAGE IMPEDANCE ASSEMBLY
    1.
    发明申请

    公开(公告)号:US20200174042A1

    公开(公告)日:2020-06-04

    申请号:US16620665

    申请日:2018-06-13

    Abstract: Impedance assembly (2) for use in a voltage divider for sensing an AC voltage of at least 1 kV versus ground of a power-carrying conductor distributing electrical energy in a grid. The impedance assembly comprises a) a printed circuit board (131) comprising one or more dielectric board layers (210, 215, 220), b) an externally accessible high-voltage contact (100), c) an externally accessible low-voltage contact (110), spaced from the high-voltage contact by at least 30 mm, and d) at least two dividing capacitors (91), connected in series between the high-voltage contact and the low-voltage contact and operable as a high-voltage side of the voltage divider. Each dividing capacitor has two electrodes formed by conductive areas (301, 302, 303, 304, 305, 306), arranged on opposed surface portions of a specific dielectric board layer, and a dielectric comprising a portion of the specific dielectric board layer on which the electrodes are arranged. Instead of the dividing capacitors, the impedance assembly may comprise a resistor layer.

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