公开(公告)号：US20170250008A1

公开(公告)日：2017-08-31

申请号：US15519399

申请日：2015-10-14

申请人： 3M INNOVATIVE PROPERTIES COMPANY

发明人： Nanayakkara L.D. SOMASIRI ,  Paul V. HUYNH ,  Andrew C. LOTTES ,  William L. TAYLOR ,  Levent BIYIKLI ,  Carl E. FISHER

IPC分类号： H01B9/02 ,  H01B17/60 ,  C09J7/00 ,  H01B17/32

CPC分类号： H01B9/027 ,  C09J7/00 ,  C09J2203/302 ,  H01B3/306 ,  H01B3/421 ,  H01B3/443 ,  H01B3/46 ,  H01B9/021 ,  H01B17/32 ,  H01B17/60

摘要： An enhanced breakdown strength dielectric material comprises a base dielectric layer having first and second opposing major surfaces. A first stress mitigating layer is disposed on the first major surface of the base dielectric layer. A second stress mitigating layer disposed on the second major surface of the base dielectric layer. A volume conductivity of at least one of the first and second stress mitigating layers is at least 2 times a volume conductivity of the base dielectric layer.