公开(公告)号：US20250001478A1

公开(公告)日：2025-01-02

申请号：US18707849

申请日：2022-11-15

Applicant: A.L.M.T. Corp.

Inventor： Akihito ONO ,  Kohichiroh KIMURA ,  Yuichiro SEKI

IPC: B21C3/02 ,  B21C1/16

Abstract: There is provided an irregularly-shaped diamond die for producing an irregularly-shaped wire, wherein a processing hole is provided, the processing hole having a reduction portion and a bearing portion in this order from an upstream side in a wire drawing direction, a corner portion having a curved shape and a non-corner portion located at a position different from a position of the corner portion are provided in a cross section of the bearing portion perpendicular to the wire drawing direction, and a surface roughness of the corner portion is greater than a surface roughness of the non-corner portion. The surface roughness Sa of the corner portion is equal to or less than 0.30 μm and the surface roughness Sa of the non-corner portion is equal to or less than 0.20 μm.

公开(公告)号：US20230321704A1

公开(公告)日：2023-10-12

申请号：US18019177

申请日：2021-08-11

Applicant: A.L.M.T. Corp. ,  Sumitomo Electric Industries, Ltd.

Inventor： Kohei KURAMOTO ,  Takuya KINOSHITA ,  Yutaka KOBAYASHI ,  Makoto YUKAWA ,  Kohichiroh KIMURA ,  Kentaro SHIRO

IPC: B21C23/08

CPC classification number: B21C23/08

Abstract: A wire drawing die 1 includes a non-diamond material, is provided with a die hole 1h, and has a reduction 1c and a bearing 1d that is positioned downstream of the reduction 1c. A reduction angle γ which is an opening angle of the die hole 1h at the reduction 1c is less than or equal to 17°, and a surface roughness Ra of the die hole 1h within ±20 μm from a specific position inside the bearing 1d in a circumferential direction of the die hole 1h that is perpendicular to a wire drawing direction is less than or equal to 0.025 μm.