公开(公告)号：US20230058175A1

公开(公告)日：2023-02-23

申请号：US17793375

申请日：2020-12-22

Applicant: A.L.M.T. Corp.

Inventor： Hiroki YAMADA ,  Makoto YUKAWA

IPC: B23B27/20 ,  B23B27/00

Abstract: A single-crystal diamond cutting tool is provided with a flank and a rake face, a cutting edge being provided at a boundary between the flank and the rake face, an inclined surface being provided at a location distant from the cutting edge, the inclined surface being contiguous to the rake face and inclined at 0.05 degrees or more and 80 degrees or less with respect to the rake face, the rake face having a roughness Ra of 1 µm or less, the cutting edge being provided with a chamfered surface or round honing having a width of 1 µm or less, the cutting edge having projections and depressions having a width of 100 nm or less and smaller than that of the chamfered surface or round honing.

公开(公告)号：US20230321704A1

公开(公告)日：2023-10-12

申请号：US18019177

申请日：2021-08-11

Applicant: A.L.M.T. Corp. ,  Sumitomo Electric Industries, Ltd.

Inventor： Kohei KURAMOTO ,  Takuya KINOSHITA ,  Yutaka KOBAYASHI ,  Makoto YUKAWA ,  Kohichiroh KIMURA ,  Kentaro SHIRO

IPC: B21C23/08

CPC classification number: B21C23/08

Abstract: A wire drawing die 1 includes a non-diamond material, is provided with a die hole 1h, and has a reduction 1c and a bearing 1d that is positioned downstream of the reduction 1c. A reduction angle γ which is an opening angle of the die hole 1h at the reduction 1c is less than or equal to 17°, and a surface roughness Ra of the die hole 1h within ±20 μm from a specific position inside the bearing 1d in a circumferential direction of the die hole 1h that is perpendicular to a wire drawing direction is less than or equal to 0.025 μm.