公开(公告)号：US20140216681A1

公开(公告)日：2014-08-07

申请号：US14172280

申请日：2014-02-04

Applicant: ABB Oy

Inventor： Jorma MANNINEN ,  Timo Koivuluoma ,  Jaakko Lehto

IPC: F28F27/00

CPC classification number: F28F27/00 ,  F25B2700/02 ,  F25B2700/2103 ,  F25D21/04 ,  F28D2021/0028 ,  H01H2009/523 ,  H05K7/206 ,  H05K7/20618

Abstract: A cooling assembly includes a device chamber, a cooling chamber separated from the device chamber, a heat exchanger, a device chamber fan arrangement and a control unit. The heat exchanger includes a first portion located in the device chamber and a second portion located in the cooling chamber for transferring heat from the device chamber to the cooling chamber. The device chamber fan arrangement is configured to generate a device chamber cooling medium flow including a first partial flow interacting with the first portion of the heat exchanger. The cooling assembly also includes a first throttle arrangement for regulating the first partial flow. The control unit is configured to reduce a cooling power of the heat exchanger as a response to predetermined operating conditions by decreasing the first partial flow with the first throttle arrangement.

Abstract translation: 冷却组件包括装置室，与装置室分离的冷却室，热交换器，装置室风扇装置和控制单元。 热交换器包括位于装置室中的第一部分和位于冷却室中的第二部分，用于将热量从装置室传递到冷却室。 装置室风扇布置被配置为产生包括与热交换器的第一部分相互作用的第一部分流的装置室冷却介质流。 冷却组件还包括用于调节第一部分流的第一节流装置。 控制单元被配置为通过利用第一节流装置减小第一部分流量来减小作为对预定操作条件的响应的热交换器的冷却功率。