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公开(公告)号：US20210212210A1
公开(公告)日：2021-07-08
申请号：US17209591
申请日：2021-03-23
Applicant: ABB Power Electronics, Inc.
Inventor： John Andrew Trelford , Richard John Yeager , Alok Kumar Lohia , Thang Danh Truong
Abstract: Interposer printed circuit boards for power modules and associated methods are disclosed. In at least one illustrative embodiment, a printed circuit board assembly may comprise a printed circuit board having a surface, an electrical component mounted on the surface, a pin mounted on the surface, and an interposer printed circuit board mounted on the surface. The electrical component may have a first height orthogonal to the surface. The pin may have a second height orthogonal to the surface, where the second height is greater than the first height. The interposer printed circuit board may comprise a pad and an outer solder bump positioned on the pad. The outer solder bump may be positioned at a third height orthogonal to the surface, where the third height is greater than the first height.
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Patent Agency Ranking
公开(公告)号：US11490517B2
公开(公告)日：2022-11-01
申请号：US16528510
申请日：2019-07-31
Applicant: ABB Power Electronics Inc.
Inventor： John Andrew Trelford , Richard John Yeager , Alok Kumar Lohia , Thang Danh Truong
IPC: H05K1/02 , H05K1/11 , H05K1/14 , H01L23/00 , H01L23/34 , H01L23/48 , H01L23/58 , H01L23/64 , H01L23/66 , H01L23/498 , H01Q1/22 , H01Q1/24 , H01Q9/04
Abstract: Interposer printed circuit boards for power modules and associated methods are disclosed. In at least one illustrative embodiment, a printed circuit board assembly may comprise a printed circuit board, an electrical component mounted on a surface of the printed circuit board, and an interposer printed circuit board mounted on the surface of the printed circuit board. The interposer printed circuit board may comprise a first signal path to transmit a first electrical signal and a second signal path to transmit a second electrical signal that is different from the first electrical signal. The interposer printed circuit board may be configured to provide a standoff to prevent the electrical component from contacting a motherboard when the printed circuit board assembly is mounted to the motherboard.
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公开(公告)号：US10993325B2
公开(公告)日：2021-04-27
申请号：US16528505
申请日：2019-07-31
Applicant: ABB Power Electronics Inc.
Inventor： John Andrew Trelford , Richard John Yeager , Alok Kumar Lohia , Thang Danh Truong
Abstract: Interposer printed circuit boards for power modules and associated methods are disclosed. In at least one illustrative embodiment, a printed circuit board assembly may comprise a printed circuit board having a surface, an electrical component mounted on the surface, a pin mounted on the surface, and an interposer printed circuit board mounted on the surface. The electrical component may have a first height orthogonal to the surface. The pin may have a second height orthogonal to the surface, where the second height is greater than the first height. The interposer printed circuit board may comprise a pad and an outer solder bump positioned on the pad. The outer solder bump may have a third height orthogonal to the surface, where the third height is greater than the first height.
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公开(公告)号：US11439013B2
公开(公告)日：2022-09-06
申请号：US17209591
申请日：2021-03-23
Applicant: ABB Power Electronics, Inc.
Inventor： John Andrew Trelford , Richard John Yeager , Alok Kumar Lohia , Thang Danh Truong
Abstract: Interposer printed circuit boards for power modules and associated methods are disclosed. In at least one illustrative embodiment, a printed circuit board assembly may comprise a printed circuit board having a surface, an electrical component mounted on the surface, a pin mounted on the surface, and an interposer printed circuit board mounted on the surface. The electrical component may have a first height orthogonal to the surface. The pin may have a second height orthogonal to the surface, where the second height is greater than the first height. The interposer printed circuit board may comprise a pad and an outer solder bump positioned on the pad. The outer solder bump may be positioned at a third height orthogonal to the surface, where the third height is greater than the first height.
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公开(公告)号：US20210037649A1
公开(公告)日：2021-02-04
申请号：US16528510
申请日：2019-07-31
Applicant: ABB Power Electronics Inc.
Inventor： John Andrew Trelford , Richard John Yeager , Alok Kumar Lohia , Thang Danh Truong
Abstract: Interposer printed circuit boards for power modules and associated methods are disclosed. In at least one illustrative embodiment, a printed circuit board assembly may comprise a printed circuit board, an electrical component mounted on a surface of the printed circuit board, and an interposer printed circuit board mounted on the surface of the printed circuit board. The interposer printed circuit board may comprise a first signal path to transmit a first electrical signal and a second signal path to transmit a second electrical signal that is different from the first electrical signal. The interposer printed circuit board may be configured to provide a standoff to prevent the electrical component from contacting a motherboard when the printed circuit board assembly is mounted to the motherboard.
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公开(公告)号：US20210037648A1
公开(公告)日：2021-02-04
申请号：US16528505
申请日：2019-07-31
Applicant: ABB Power Electronics Inc.
Inventor： John Andrew Trelford , Richard John Yeager , Alok Kumar Lohia , Thang Danh Truong
Abstract: Interposer printed circuit boards for power modules and associated methods are disclosed. In at least one illustrative embodiment, a printed circuit board assembly may comprise a printed circuit board having a surface, an electrical component mounted on the surface, a pin mounted on the surface, and an interposer printed circuit board mounted on the surface. The electrical component may have a first height orthogonal to the surface. The pin may have a second height orthogonal to the surface, where the second height is greater than the first height. The interposer printed circuit board may comprise a pad and an outer solder bump positioned on the pad. The outer solder bump may have a third height orthogonal to the surface, where the third height is greater than the first height.
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