COOLING ARRANGEMENT FOR A HIGH VOLTAGE POWER DEVICE

    公开(公告)号:US20210257144A1

    公开(公告)日:2021-08-19

    申请号:US17255842

    申请日:2019-06-25

    Abstract: The invention is concerned with a cooling arrangement for a high voltage power device in an enclosure and immersed in an insulating fluid. The arrangement includes a cooling device for placing in the interior of the enclosure and having a channel formed as a duct for the insulating fluid the duct having a first wall including a phase change material for cooling insulating fluid that passes through the channel. The invention is also concerned with a method of operating a valve of a cooling device in such a cooling arrangement.

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