Pressure relief arrangement
    1.
    发明授权

    公开(公告)号:US11572959B2

    公开(公告)日:2023-02-07

    申请号:US17329475

    申请日:2021-05-25

    申请人: ABB Schweiz AG

    摘要: The arrangement includes a pressure relief hatch for closing an opening in a wall in an electric cabinet, which. includes a body having an outer surface, an opposite inner surface, an outer perimeter, and a thickness. The body includes a centre portion with a first thickness, an intermediate portion with a second thickness, and an outer portion with a third thickness. The first thickness is greater than the third thickness and the second thickness decreases in a radially outward direction from the first thickness to the third thickness. A spring keeps the pressure relief hatch in a closed position in the opening during normal operation of the electric cabinet.

    Apparatus for conducting heat
    2.
    发明授权

    公开(公告)号:US11412637B2

    公开(公告)日:2022-08-09

    申请号:US16888944

    申请日:2020-06-01

    申请人: ABB Schweiz AG

    IPC分类号: H05K7/20 H01R13/00 H01R13/73

    摘要: An apparatus for conducting heat, including a substrate for receiving one or more electric components and a thermal substance circulation system. The substrate includes a first interface for receiving a first part of the thermal substance circulation system and a second interface for receiving a second part of the thermal substance circulation system such that the substrate is, when in use, in contact with the thermal substance of the circulation system between the first and the second interface. The substrate is heat conductive for transferring heat between the one or more electric components and the thermal substance of the circulation system.

    Pressure Relief Arrangement
    3.
    发明申请

    公开(公告)号:US20210388912A1

    公开(公告)日:2021-12-16

    申请号:US17329475

    申请日:2021-05-25

    申请人: ABB Schweiz AG

    摘要: The arrangement includes a pressure relief hatch for closing an opening in a wall in an electric cabinet, which. includes a body having an outer surface, an opposite inner surface, an outer perimeter, and a thickness. The body includes a centre portion with a first thickness, an intermediate portion with a second thickness, and an outer portion with a third thickness. The first thickness is greater than the third thickness and the second thickness decreases in a radially outward direction from the first thickness to the third thickness. A spring keeps the pressure relief hatch in a closed position in the opening during normal operation of the electric cabinet.

    Electronics enclosure arrangement for an electric device and an electric device

    公开(公告)号:US11602061B2

    公开(公告)日:2023-03-07

    申请号:US17323411

    申请日:2021-05-18

    申请人: ABB Schweiz AG

    IPC分类号: H05K5/02 H05K5/00

    摘要: A field of enclosures for electronics and electrical components within electric devices, such as electric drive devices for industrial applications, e.g. for working machine and marine applications, and more particularly to an electronics enclosure arrangement for an electric device, and to an electric device. The electronics enclosure arrangement according to the present invention is arranged for an electric device, the electric device including one or more circuit boards and electronics components assembled on the one or more circuit boards, wherein the electronics enclosure arrangement includes an electronics enclosure cover; and an at least one volume element part, arranged in the space between the electronics enclosure cover and the one or more circuit boards with the electronics components.

    Electronics Enclosure Arrangement For An Electric Device And An Electric Device

    公开(公告)号:US20210368638A1

    公开(公告)日:2021-11-25

    申请号:US17323411

    申请日:2021-05-18

    申请人: ABB Schweiz AG

    摘要: A field of enclosures for electronics and electrical components within electric devices, such as electric drive devices for industrial applications, e.g. for working machine and marine applications, and more particularly to an electronics enclosure arrangement for an electric device, and to an electric device. The electronics enclosure arrangement according to the present invention is arranged for an electric device, the electric device including one or more circuit boards and electronics components assembled on the one or more circuit boards, wherein the electronics enclosure arrangement includes an electronics enclosure cover; and an at least one volume element part, arranged in the space between the electronics enclosure cover and the one or more circuit boards with the electronics components.

    APPARATUS FOR CONDUCTING HEAT
    6.
    发明申请

    公开(公告)号:US20200383242A1

    公开(公告)日:2020-12-03

    申请号:US16888944

    申请日:2020-06-01

    申请人: ABB Schweiz AG

    IPC分类号: H05K7/20 H05K1/02

    摘要: An apparatus for conducting heat, including a substrate for receiving one or more electric components and a thermal substance circulation system. The substrate includes a first interface for receiving a first part of the thermal substance circulation system and a second interface for receiving a second part of the thermal substance circulation system such that the substrate is, when in use, in contact with the thermal substance of the circulation system between the first and the second interface. The substrate is heat conductive for transferring heat between the one or more electric components and the thermal substance of the circulation system.