公开(公告)号：US09601242B2

公开(公告)日：2017-03-21

申请号：US14207890

申请日：2014-03-13

Applicant: ABB Technology AG

Inventor： Ansgar Dais ,  Jan Czyzewski ,  Victoria Maurer ,  Walter Odermatt

IPC: B29C33/00 ,  B29C39/10 ,  B29C39/40 ,  H01B19/04 ,  H01B17/56 ,  B29C33/26

CPC classification number: H01B17/56 ,  B29C33/0038 ,  B29C33/005 ,  B29C33/26 ,  B29C39/10 ,  B29C39/40 ,  H01B19/04

Abstract: An exemplary mold is disclosed for impregnating a prefabricated condenser core (C) of a high voltage bushing with a liquid resin and includes two mold modules movable against each other and shaped to form an axially symmetric mold cavity. The mold forms a column of cylindrical design, in which the at least two mold modules are arranged on top of each other. A first of the two mold modules can be executed as a hollow cylinder. Two opposing front faces of the two mold modules and a circular O-ring arranged between the two opposing front faces form a first sealing interface of the metal mold. Such a mold can have a very efficient sealing system and allow high pressures to be applied to the liquid resin and a beneficial forming of the condenser core in a device in which the resin is cured according to a specified temperature profile.