公开(公告)号：US20150359143A1

公开(公告)日：2015-12-10

申请号：US14734437

申请日：2015-06-09

Applicant: ABB Technology Oy

Inventor： Mika SILVENNOINEN ,  Juha MARTINMAA ,  Heikki MÖRSKY

IPC: H05K7/20 ,  B23P15/26

CPC classification number: H05K7/20509 ,  B23P15/26 ,  H01L23/3736 ,  H01L23/42 ,  H01L2924/0002 ,  Y10T29/49352 ,  H01L2924/00

Abstract: An exemplary method of heat transfer in power electronics applications is disclosed, wherein a metal foil including at least about 50% of tin, based on a total amount of metals contained in the metal foil, is used as a thermal interface material between a base plate of a heat-generating component and a heat sink. The metal foil is disposed on a heat sink. A base plate of a heat generating component or module is disposed on the heat sink covered by the metal foil to provide a power electronics device. A clamping force is applied to the power electronics assembly to provide a cooled power electronics assembly.

Abstract translation: 公开了一种在电力电子应用中的热传递的示例性方法，其中基于所述金属箔中包含的金属的总量，包括至少约50％的锡的金属箔被用作基板之间的热界面材料 的发热部件和散热器。 金属箔设置在散热器上。 发热部件或模块的基板设置在由金属箔覆盖的散热器上，以提供电力电子设备。 夹紧力被施加到电力电子组件以提供冷却的电力电子组件。