公开(公告)号：US20140171423A1

公开(公告)日：2014-06-19

申请号：US14101912

申请日：2013-12-10

Applicant: ABBVIE INC.

Inventor： Pramila A. Bhatia ,  John T. Randolph ,  Michael R. Schrimpf ,  Quinwei I. Zhang

IPC: C07D487/04

CPC classification number: C07D487/04

Abstract: This invention relates to: (a) compounds and salts thereof that, inter alia, treat pain; (b) intermediates useful for the preparation of such compounds and salts; (c) compositions comprising such compounds and salts; (d) methods for preparing such intermediates, compounds, salts, and compositions; (e) methods of use of such compounds, salts, and compositions; and (f) kits comprising such compounds, salts, and compositions.

Abstract translation: 本发明涉及：（a）其特别是治疗疼痛的化合物及其盐; （b）可用于制备这些化合物和盐的中间体; （c）包含这些化合物和盐的组合物; （d）制备这种中间体，化合物，盐和组合物的方法; （e）使用这些化合物，盐和组合物的方法; 和（f）包含这些化合物，盐和组合物的试剂盒。