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公开(公告)号：US20210285108A1
公开(公告)日：2021-09-16
申请号：US17335453
申请日：2021-06-01
Applicant: ADVANCED TECHNOLOGIES, INC.
Inventor： Kinji HIRAI , Isamu AKIYAMA , Tsukasa TAKAHASHI , Takutaka SUGAYA , Yuka MUTO
IPC: C23C22/52 , B29C65/48 , B32B15/09 , B32B15/20 , C23C22/05 , H05K3/38 , B29C65/00 , B29C65/02 , C23C26/00 , H05K1/03
Abstract: Disclosed is a copper alloy article including: a substrate 10 made of a copper alloy; a polyester-based resin body 40; and a compound layer 20 for bonding the substrate 10 and the polyester-based resin body 40, wherein the compound layer 20 contains; a compound having a nitrogen-containing functional group and a silanol group, and an alkane type amine-based silane coupling agent.
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公开(公告)号：US20200377767A1
公开(公告)日：2020-12-03
申请号：US16635660
申请日：2018-05-14
Applicant: ADVANCED TECHNOLOGIES, INC.
Inventor： Kinji HIRAI , Isamu AKIYAMA , Tsukasa TAKAHASHI , Takutaka SUGAYA , Yuka MUTO
Abstract: A metal article characterized by including a metal substrate, a resin substrate, and a compound layer for bonding the metal substrate and resin substrate; the compound layer being a first compound layer including a first compound having a nitrogen-containing functional group and a silanol group, and a second compound which is an alkane-type amine-based silane coupling agent, and the first compound not containing sulfur atoms.
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3.发明申请公开(公告)号：US20190078213A1
公开(公告)日：2019-03-14
申请号：US16072597
申请日：2017-01-12
Applicant: ADVANCED TECHNOLOGIES, INC.
Inventor： Kinji HIRAI , Isamu AKIYAMA , Tsukasa TAKAHASHI , Takutaka SUGAYA , Yuka MUTO
Abstract: Disclosed is a copper alloy article including: a substrate 10 made of a copper alloy; a polyester-based resin body 40; and a compound layer 20 for bonding the substrate 10 and the polyester-based resin body 40, wherein the compound layer 20 contains; a compound having a nitrogen-containing functional group and a silanol group, and an alkane type amine-based silane coupling agent.
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