公开(公告)号：US11090767B2

公开(公告)日：2021-08-17

申请号：US16414320

申请日：2019-05-16

Applicant: AGC Inc.

Inventor： Masabumi Ito ,  Itsuro Watanabe ,  Hiroyuki Ezura ,  Masahiro Deguchi ,  Keisuke Kato

IPC: B23K26/364 ,  C03C19/00 ,  B28D5/00 ,  C03B33/027 ,  C03B33/09 ,  B24B9/10 ,  B23Q35/10 ,  B25J13/00 ,  B24B17/02 ,  B24B27/00 ,  B23K103/00

Abstract: A machining apparatus for a curved plate includes a holder that holds a main surface of a curved plate having curved surfaces on both main surfaces; a machining device that machines an outer circumference of the curved plate held by the holder; a movable frame that retains the machining device; a driver that moves the movable frame to move a machining point of the curved plate held by the holder; a controller that controls the driver; and a guide that guides the movable frame along the outer circumference of the curved plate held by the holder.

公开(公告)号：US20190270166A1

公开(公告)日：2019-09-05

申请号：US16414320

申请日：2019-05-16

Applicant: AGC Inc.

Inventor： Masabumi ITO ,  Itsuro Watanabe ,  Hiroyuki Ezura ,  Masahiro Deguchi ,  Keisuke Kato

IPC: B23K26/364

Abstract: A machining apparatus for a curved plate includes a holder that holds a main surface of a curved plate having curved surfaces on both main surfaces; a machining device that machines an outer circumference of the curved plate held by the holder; a movable frame that retains the machining device; a driver that moves the movable frame to move a machining point of the curved plate held by the holder; a controller that controls the driver; and a guide that guides the movable frame along the outer circumference of the curved plate held by the holder.