公开(公告)号：US10241404B2

公开(公告)日：2019-03-26

申请号：US15627842

申请日：2017-06-20

Applicant: AGC Inc.

Inventor： Masaki Obi ,  Tomoaki Sakurada ,  Takefumi Abe

IPC: G06F7/16 ,  G03F7/20 ,  G03F7/004 ,  G03F7/038 ,  C08F8/30 ,  C08F220/22 ,  C08F290/12 ,  G03F7/16

Abstract: To provide a photosensitive resin composition containing a crosslinkable fluororesin which hardly damages a substrate of e.g. an organic semiconductor when a resin film is formed, and a resin film using it, an organic semiconductor device and its production process, and a fluororesin suitable for the photosensitive resin composition.A photosensitive resin composition comprising a fluororesin having a polymerizable carbon-carbon double bond and having a fluorine atom content of at least 47 mass %, a crosslinking agent having a polymerizable carbon-carbon double bond (excluding the fluororesin), a photoinitiator and a non-aromatic fluorinated solvent.