Sensor cover and sensor module
    1.
    发明授权

    公开(公告)号:US12222222B2

    公开(公告)日:2025-02-11

    申请号:US18625325

    申请日:2024-04-03

    Applicant: AGC Inc.

    Abstract: A sensor cover, provided in an opening of a housing that houses a sensor, includes a conductor; a dielectric multilayer film; and a heating film, in a desired order from an outside of the housing toward an inside of the housing. The conductor and the heating film are insulated from each other. A shortest distance between the conductor and the heating film is 2.0 μm or more.

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