公开(公告)号：US20250092291A1

公开(公告)日：2025-03-20

申请号：US18964054

申请日：2024-11-29

Applicant: AGC Inc.

Inventor： Shogo FUJISAKI ,  Hitoshi SHIMOMA ,  Xuhui LIU ,  Takashi ITO ,  Yoshitaka SUNAYAMA ,  Makito NAKAMURA

IPC: C09J171/02 ,  B32B7/12 ,  B32B27/08 ,  B32B27/16 ,  B32B27/32

Abstract: The present invention provides an adhesive composition excellent in adhesiveness to resin materials, and an article containing a cured product of the adhesive composition. The adhesive composition of the present invention includes a polyether polycarbonate diol that has a number average molecular weight of 500 to 10000, and has no specific reactive silicon group, or a polyether polycarbonate polymer (A) having the specific reactive silicon group.