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公开(公告)号：US10669152B2
公开(公告)日：2020-06-02
申请号：US15768531
申请日：2016-10-06
Applicant: AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH
Inventor： Navab Singh , Jae Wung Lee , Srinivas Merugu
Abstract: Various embodiments may provide a device arrangement. The device arrangement may include a substrate including a conductive layer. The device arrangement may further include a microelectromechanical systems (MEMS) device monolithically integrated with the substrate, wherein the MEMS device may be electrically coupled to the conductive layer. A cavity may be defined through the conductive layer for acoustically isolating the MEMS device MEMS device from the substrate. At least one anchor structure may be defined by the conductive layer to support the MEMS device.
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