公开(公告)号：US11569146B2

公开(公告)日：2023-01-31

申请号：US16312987

申请日：2017-06-08

Applicant: AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH

Inventor： Ka Fai Chang ,  Yong Han ,  David Soon Wee Ho ,  Ying Ying Lim

IPC: H01L23/367 ,  H01L23/31 ,  H01L23/42 ,  H01L23/498 ,  H01L23/66 ,  H01Q1/22 ,  H01L23/64

Abstract: Various embodiments may provide a semiconductor package. The semiconductor package may include a semiconductor chip, a first mold compound layer at least partially covering the semiconductor chip, and a redistribution layer over the first mold compound layer, the redistribution layer including one or more electrically conductive lines in electrical connection with the semiconductor chip. The semiconductor package may additionally include a second mold compound layer over the redistribution layer, and an antenna array over the second mold compound layer, the antenna array configured to be coupled to the one or more electrically conductive lines.