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公开(公告)号:US11339083B2
公开(公告)日:2022-05-24
申请号:US16732825
申请日:2020-01-02
Applicant: AGY Holding Corporation
Inventor: Robert Lurie Hausrath , Anthony Vincent Longobardo
Abstract: Glass compositions and glass fibers having low dielectric constants and low dissipation factors that may be suitable for use in electronic applications and articles are disclosed. The glass fibers and compositions of the present invention may include between 48.0 to 57.0 weight percent SiO2; between 15.0 and 26.0 weight percent B2O3; between 12.0 and 18.0 weight percent Al2O3; between 3.0 and 8.0 weight percent P2O5; between 0.25 and 7.00 weight percent CaO; 5.0 or less weight percent MgO; and 6.0 or less weight percent TiO2. Further, the glass composition has a glass viscosity of 1000 poise at a temperature greater than 1350 degrees Celsius and a liquidus temperature greater than 1100 degrees Celsius.
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公开(公告)号:US11739023B2
公开(公告)日:2023-08-29
申请号:US16792658
申请日:2020-02-17
Applicant: AGY Holding Corporation
Inventor: Robert Lurie Hausrath , Anthony Vincent Longobardo
CPC classification number: C03C13/006 , C03B37/02 , C03C3/097 , C03C10/0036 , C03C10/0054 , H05K1/0306 , C03C2204/00 , C03C2213/00
Abstract: Glass compositions and glass fibers having low dielectric constants and low dissipation factors that may be suitable for use in electronic applications and articles are disclosed. The glass fibers and compositions of the present invention may include between 48.0 to 58.0 weight percent SiO2; between 15.0 and 26.0 weight percent B2O3; between 12.0 and 18.0 weight percent Al2O3; between greater than 0.25 and 3.0 weight percent P2O5; between greater than 0.25 and 7.00 weight percent CaO; 5.0 or less weight percent MgO; between greater than 0 and 1.5 weight percent SnO2; and 6.0 or less weight percent TiO2. Further, the glass composition has a glass viscosity of 1000 poise at a temperature greater than 1350 degrees Celsius and a liquidus temperature greater than 1000 degrees Celsius.
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公开(公告)号:US10562810B2
公开(公告)日:2020-02-18
申请号:US16474287
申请日:2017-12-21
Applicant: AGY Holding Corporation
Inventor: Robert Lurie Hausrath , Anthony Vincent Longobardo , Brian Gene Ruppel
Abstract: Glass compositions and glass fibers having low dielectric constants and low dissipation factors that may be suitable for use in electronic applications and articles are disclosed. The glass fibers and compositions of the present invention may include between 45.0 to 58.0 weight percent SiO2; greater than 18.0 weight percent B2O3 and no more than 26.0 weight percent B2O3; greater than 16.0 weight percent Al2O3 and no more than 23.0 weight percent Al2O3; between 0.25 to 12.0 weight percent P2O5; greater than 0.25 weight percent CaO and less than 5.00 weight percent CaO; less than 4.50 weight percent MgO; greater than 0.25 weight percent CaO+MgO and less than 5.00 weight percent CaO+MgO; less than 0.80 weight percent Fe2O3; and less than 0.50 weight percent TiO2. Further, the glass composition has a glass viscosity of 1000 poise at a temperature greater than 1350 degrees Celsius.
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公开(公告)号:US20190337839A1
公开(公告)日:2019-11-07
申请号:US16474287
申请日:2017-12-21
Applicant: AGY Holding Corporation
Inventor: Robert Lurie Hausrath , Anthony Vincent Longobardo , Brian Gene Ruppel
Abstract: Glass compositions and glass fibers having low dielectric constants and low dissipation factors that may be suitable for use in electronic applications and articles are disclosed. The glass fibers and compositions of the present invention may include between 45.0 to 58.0 weight percent SiO2; greater than 18.0 weight percent B2O3 and no more than 26.0 weight percent B2O3; greater than 16.0 weight percent AI2O3 and no more than 23.0 weight percent AI2O3; between 0.25 to 12.0 weight percent P2O5; greater than 0.25 weight percent CaO and less than 5.00 weight percent CaO; less than 4.50 weight percent MgO; greater than 0.25 weight percent CaO+MgO and less than 5.00 weight percent CaO+MgO; less than 0.80 weight percent Fe2O3; and less than 0.50 weight percent TiO2. Further, the glass composition has a glass viscosity of 1000 poise at a temperature greater than 1350 degrees Celsius.
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