Low dielectric glass composition, fibers, and article

    公开(公告)号:US11339083B2

    公开(公告)日:2022-05-24

    申请号:US16732825

    申请日:2020-01-02

    Abstract: Glass compositions and glass fibers having low dielectric constants and low dissipation factors that may be suitable for use in electronic applications and articles are disclosed. The glass fibers and compositions of the present invention may include between 48.0 to 57.0 weight percent SiO2; between 15.0 and 26.0 weight percent B2O3; between 12.0 and 18.0 weight percent Al2O3; between 3.0 and 8.0 weight percent P2O5; between 0.25 and 7.00 weight percent CaO; 5.0 or less weight percent MgO; and 6.0 or less weight percent TiO2. Further, the glass composition has a glass viscosity of 1000 poise at a temperature greater than 1350 degrees Celsius and a liquidus temperature greater than 1100 degrees Celsius.

    Low dielectric glass composition, fibers, and article

    公开(公告)号:US10562810B2

    公开(公告)日:2020-02-18

    申请号:US16474287

    申请日:2017-12-21

    Abstract: Glass compositions and glass fibers having low dielectric constants and low dissipation factors that may be suitable for use in electronic applications and articles are disclosed. The glass fibers and compositions of the present invention may include between 45.0 to 58.0 weight percent SiO2; greater than 18.0 weight percent B2O3 and no more than 26.0 weight percent B2O3; greater than 16.0 weight percent Al2O3 and no more than 23.0 weight percent Al2O3; between 0.25 to 12.0 weight percent P2O5; greater than 0.25 weight percent CaO and less than 5.00 weight percent CaO; less than 4.50 weight percent MgO; greater than 0.25 weight percent CaO+MgO and less than 5.00 weight percent CaO+MgO; less than 0.80 weight percent Fe2O3; and less than 0.50 weight percent TiO2. Further, the glass composition has a glass viscosity of 1000 poise at a temperature greater than 1350 degrees Celsius.

    LOW DIELECTRIC GLASS COMPOSITION, FIBERS, AND ARTICLE

    公开(公告)号:US20190337839A1

    公开(公告)日:2019-11-07

    申请号:US16474287

    申请日:2017-12-21

    Abstract: Glass compositions and glass fibers having low dielectric constants and low dissipation factors that may be suitable for use in electronic applications and articles are disclosed. The glass fibers and compositions of the present invention may include between 45.0 to 58.0 weight percent SiO2; greater than 18.0 weight percent B2O3 and no more than 26.0 weight percent B2O3; greater than 16.0 weight percent AI2O3 and no more than 23.0 weight percent AI2O3; between 0.25 to 12.0 weight percent P2O5; greater than 0.25 weight percent CaO and less than 5.00 weight percent CaO; less than 4.50 weight percent MgO; greater than 0.25 weight percent CaO+MgO and less than 5.00 weight percent CaO+MgO; less than 0.80 weight percent Fe2O3; and less than 0.50 weight percent TiO2. Further, the glass composition has a glass viscosity of 1000 poise at a temperature greater than 1350 degrees Celsius.

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