公开(公告)号：US20130301273A1

公开(公告)日：2013-11-14

申请号：US13837733

申请日：2013-03-15

Applicant: ALCOA INC.

Inventor： Edmund Chu ,  Kelly Whitaker-Weiler ,  J.R. Bushik ,  Jeffrey Shoup ,  Narsimhan Raghunathan ,  Luis Fanor Vega ,  Jason Bely ,  Gary L. Myers ,  Gary L. Hunker ,  Barry E. Soxman ,  Anthony J. Fedusa ,  Robert E. Dick ,  Darl G. Boysel ,  Eileen M. Kenzevich

IPC: F21V29/00

CPC classification number: F21V29/89 ,  F21K9/23 ,  F21K9/232 ,  F21V3/00 ,  F21V29/507 ,  F21V29/70 ,  F21V29/83 ,  F21Y2115/10

Abstract: A device for thermal management of an electronic component includes an inner shell dimensioned to house an electrical circuit and a thermally conductive metal outer shell. The metal outer shell has a thickness less than 6.3246 mm; a first closed end having a first diameter and dimensioned to support an electronic component operably connected to the electrical circuit; and a second end having a second diameter, wherein the first diameter is greater than the second diameter. The inner shell is at least partially within the outer shell. The outer shell is comprised of a single metal sheet. The thinnest portion of the outer metal shell is less than or equal to 0.75 times the thickest portion of the outer metal shell.

Abstract translation: 一种用于电子部件的热管理的装置包括尺寸设计成容纳电路和导热金属外壳的内壳。 金属外壳厚度小于6.3246mm; 第一封闭端具有第一直径并且尺寸设计成支撑可操作地连接到电路的电子部件; 以及具有第二直径的第二端，其中所述第一直径大于所述第二直径。 内壳至少部分地在外壳内。 外壳由单个金属板构成。 外金属壳的最薄部分小于或等于外金属壳最厚部分的0.75倍。