公开(公告)号：US09814147B2

公开(公告)日：2017-11-07

申请号：US14808576

申请日：2015-07-24

申请人： ALPINE ELECTRONICS, INC.

发明人： Yasuyuki Igari ,  Shinobu Kida ,  Tatsuya Watanabe ,  Takao Okabe

IPC分类号： H05K5/00 ,  H01R12/72

CPC分类号： H05K5/006 ,  H01R12/724 ,  H05K5/0052 ,  H05K5/0069

摘要： A housing includes a first chassis and a second chassis which are each formed of a metal sheet. Support projections integrally formed with support pieces formed in the first chassis are fitted into support holes of a circuit board on both left and right sides of a connector. A lower surface of the circuit board is supported by receiving portions formed in the support pieces, and part of the circuit board facing the connector is pressed downward by a pressing projection formed in the second chassis.

公开(公告)号：US20160044799A1

公开(公告)日：2016-02-11

申请号：US14808576

申请日：2015-07-24

申请人： ALPINE ELECTRONICS, INC.

发明人： Yasuyuki Igari ,  Shinobu Kida ,  Tatsuya Watanabe ,  Takao Okabe

IPC分类号： H05K5/00 ,  H01R12/70 ,  H05K7/14

CPC分类号： H05K5/006 ,  H01R12/724 ,  H05K5/0052 ,  H05K5/0069

摘要： A housing includes a first chassis and a second chassis which are each formed of a metal sheet. Support projections integrally formed with support pieces formed in the first chassis are fitted into support holes of a circuit board on both left and right sides of a connector. A lower surface of the circuit board is supported by receiving portions formed in the support pieces, and part of the circuit board facing the connector is pressed downward by a pressing projection formed in the second chassis.

摘要翻译： 壳体包括由金属片形成的第一底架和第二底架。 与形成在第一机架中的支撑件一体形成的支撑突起装配在连接器的左右两侧的电路板的支撑孔中。 电路板的下表面由形成在支撑件中的接收部支撑，并且面对连接器的电路板的一部分被形成在第二机架中的按压突起向下压。