公开(公告)号：US09335379B2

公开(公告)日：2016-05-10

申请号：US14525921

申请日：2014-10-28

申请人： AMBIT MICROSYSTEMS (SHANGHAI) LTD. ,  HON HAI PRECISION INDUSTRY CO., LTD.

发明人： Pei Liu ,  Xiao-Ying Qiu

IPC分类号： G01R31/327 ,  H02H3/00 ,  H01L27/02

CPC分类号： G01R31/3277 ,  G01R31/3278 ,  G06F21/86 ,  H01L27/0248

摘要： A product outer shell containing its own record of any private and unwarranted disassembly includes a first outer element, a second outer element detachably connected with the second outer element, a consumer disassembly inhibiting structure. The consumer disassembly inhibiting structure includes a circuit board, a plurality of special conductive bodies, a plurality of general conductive bodies, and a positioning plate. The special conductive bodies and general conductive bodies all have the same structures and each is secured on the circuit board to electrically connect to a chip located on the circuit board. A conductive piece is positioned on the positioning plate and is coupled with the special conductive bodies. The chip is configured to record electric connections between the special conductive bodies and the conductive piece, the original electric connections being changed to other or no connections after any disassembly of the product outer shell.

摘要翻译： 包含其自己的任何私人和无理拆卸记录的产品外壳包括第一外部元件，与第二外部元件可拆卸地连接的第二外部元件，消费者拆卸禁止结构。 消费者拆解禁止结构包括电路板，多个特殊导电体，多个通用导电体和定位板。 特殊的导电体和一般导电体都具有相同的结构，并且每个都固定在电路板上以电连接到位于电路板上的芯片。 导电片位于定位板上并与特殊的导体相连。 芯片被配置为记录特殊导电体和导电片之间的电连接，在产品外壳拆卸之后，原始电连接被改变为其它连接或不连接。