公开(公告)号：US10854560B2

公开(公告)日：2020-12-01

申请号：US16502803

申请日：2019-07-03

Applicant: AOI Electronics Co., Ltd. ,  Mitsubishi Electric Corporation

Inventor： Shuichi Sawamoto ,  Koji Iwabu ,  Katsuhiro Takao ,  Akihito Hirai ,  Joichi Saito

IPC: H01L23/552 ,  H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  H01L21/48 ,  H01L23/495

Abstract: A semiconductor device includes: an island that is formed by a metallic layer including a single metallic layer or a plurality of different metallic layers; a semiconductor chip provided upon an upper surface of the island, and having a pair of side portions mutually opposing each other; a plurality of signal terminals disposed at an external periphery of at least the pair of side portions of the semiconductor chip, and formed by the metallic layer; a grounding terminal disposed at an external periphery of the plurality of signal terminals, and formed by the metallic layer; electrically conductive connection members that are connected between each of a plurality of electrodes of the semiconductor chip and each of the plurality of signal terminals; sealing resin that seals the island, the semiconductor chip, the electrically conductive connection members, the plurality of signal terminals, and the grounding terminal, so that a lower surface of the island, lower surfaces of the plurality of signal terminals, and a lower surface of the grounding terminal are exposed to the exterior; and a metallic shielding layer that covers over an outer peripheral side surface and an upper surface of the sealing resin, and a portion of the grounding terminal.

公开(公告)号：US10854557B2

公开(公告)日：2020-12-01

申请号：US15742071

申请日：2016-05-19

Applicant: AOI Electronics Co., Ltd. ,  Mitsubishi Electric Corporation

Inventor： Shuichi Sawamoto ,  Koji Iwabu ,  Katsuhiro Takao ,  Akihito Hirai ,  Joichi Saito

IPC: H01L21/56 ,  H01L23/552 ,  H01L23/31 ,  H01L23/00 ,  H01L21/48 ,  H01L23/495

Abstract: A semiconductor device includes: an island that is formed by a metallic layer including a single metallic layer or a plurality of different metallic layers; a semiconductor chip provided upon an upper surface of the island, and having a pair of side portions mutually opposing each other; a plurality of signal terminals disposed at an external periphery of at least the pair of side portions of the semiconductor chip, and formed by the metallic layer; a grounding terminal disposed at an external periphery of the plurality of signal terminals, and formed by the metallic layer; electrically conductive connection members that are connected between each of a plurality of electrodes of the semiconductor chip and each of the plurality of signal terminals; sealing resin that seals the island, the semiconductor chip, the electrically conductive connection members, the plurality of signal terminals, and the grounding terminal, so that a lower surface of the island, lower surfaces of the plurality of signal terminals, and a lower surface of the grounding terminal are exposed to the exterior; and a metallic shielding layer that covers over an outer peripheral side surface and an supper surface of the sealing resin, and a portion of the grounding terminal.