公开(公告)号：US20250110165A1

公开(公告)日：2025-04-03

申请号：US18806223

申请日：2024-08-15

Applicant: APPLE INC.

Inventor： Shaowu Huang ,  Jing Li Lim ,  Keong W. Kam ,  Ramachandran Chundru

IPC: G01R31/00 ,  G02B27/01 ,  G06F1/16 ,  H01R13/648 ,  H05K9/00

Abstract: A method for electrostatic discharge testing of a head-mounted device including a housing and a headband coupled to the housing includes the steps of applying a shielding material to the head-mounted device such that the shielding material covers an outer surface of the housing and an outer surface of the headband, removing a first portion of the shielding material from a first area of the head-mounted device, applying an electrical charge to the head-mounted device, and assessing the head-mounted device for coupling paths associated with an electrostatic discharge failure.

公开(公告)号：US20250113473A1

公开(公告)日：2025-04-03

申请号：US18806217

申请日：2024-08-15

Applicant: APPLE INC.

Inventor： Shaowu Huang ,  Jan K. Quijalvo ,  Jing Li Lim ,  Keong W. Kam ,  Martin R. Kardasz ,  Michael J. Woods ,  Ramachandran Chundru

IPC: H05K9/00 ,  G06F1/16

Abstract: A head-mounted device includes a frame and an optical module movably coupled to the frame. The optical module includes a display configured to show content to a user wearing the head-mounted device and an optical module control board electrically coupled to the display. The optical module control board is configured to provide the content to the display. A shield is coupled to the optical module control board and is configured to dissipate an electrical charge.

公开(公告)号：US20250113425A1

公开(公告)日：2025-04-03

申请号：US18806229

申请日：2024-08-15

Applicant: APPLE INC.

Inventor： Shaowu Huang ,  Keong W. Kam ,  Jing Li Lim ,  Ramachandran Chundru ,  Jan K. Quijalvo ,  Michael J. Woods ,  Martin R. Kardasz

IPC: H05F3/02 ,  G06F1/16 ,  H01R24/40

Abstract: A head-mounted device includes a flexible cable that electrically connects a fixed component to a movable component. The flexible cable includes a conductive shield layer that inhibits electrical interference with signals transmitted along the flexible cable. A grounding member provides a low impedance path from the shield layer to a conductive frame of the head-mounted device to reduce the likelihood and/or severity of electrostatic discharge events and/or electrostatic coupling that may affect the head-mounted device.

公开(公告)号：US20250113474A1

公开(公告)日：2025-04-03

申请号：US18806239

申请日：2024-08-15

Applicant: APPLE INC.

Inventor： Shaowu Huang ,  Keong W. Kam ,  Ramachandran Chundru ,  Jing Li Lim ,  Martin R. Kardasz ,  Jan K. Quijalvo ,  Michael J. Woods

IPC: H05K9/00 ,  G06F1/16

Abstract: A head-mounted device includes a frame and a stage movably coupled to the frame. The head-mounted device includes an optical module that is configured to show content, is coupled to the stage, and is configured to move laterally relative to the frame. An optical module control board is configured to provide the content to the optical module and has a surface that includes exposed electrical connections positioned around a perimeter of the surface. The head-mounted device also includes a shield assembly that has a first shield portion and a second shield portion. The first shield portion is configured to cover the surface of the optical module control board, to extend partially around the perimeter of the surface to cover the exposed electrical connections, and to dissipate an electrical charge. The second shield portion is configured to cover a flexible electrical connector.

公开(公告)号：US20250113472A1

公开(公告)日：2025-04-03

申请号：US18806212

申请日：2024-08-15

Applicant: APPLE INC.

Inventor： Shaowu Huang ,  Jing Li Lim ,  Keong W. Kam ,  Michael J. Woods ,  Ramachandran Chundru ,  Jan K. Quijalvo ,  Martin R. Kardasz

IPC: H05K9/00 ,  G06F1/16

Abstract: A head-mounted device includes a connector that electrically connects a first component to a second component. A first low impedance path is provided from the connector to the first component. A second low impedance path is provided from the first component to the second component. The first low impedance path and the second low impedance path reduce the likelihood and/or severity of electrostatic discharge events and/or electrostatic coupling that may affect the head-mounted device.