公开(公告)号：US10587070B2

公开(公告)日：2020-03-10

申请号：US16174219

申请日：2018-10-29

Applicant: APPLE INC.

Inventor： Ross C. Heyman ,  Cesar Lozano Villarreal ,  Johnathan D. Simeroth

IPC: H01R13/506 ,  H01R43/20 ,  H01R13/66

Abstract: An enclosure for an electronic device includes a housing having a wall defining a cavity that is configured to receive an electronic assembly therein. The wall includes a distal end having a tongue. A cap is sized to attach to the housing with a corresponding groove that is formed in a perimeter of the cap. A double shear weld joint is formed between the tongue and the groove such that flash from the weld is contained within the enclosure and is not visible on the exterior surface of the enclosure.

公开(公告)号：US11515679B2

公开(公告)日：2022-11-29

申请号：US17092022

申请日：2020-11-06

Applicant: Apple Inc.

Inventor： Matthew A. Lashinsky ,  Arun R. Varma ,  Cesar Lozano Villarreal ,  Mathieu P. Roy ,  Balal Khan ,  Johnathan D. Simeroth

IPC: H01R31/06 ,  H05K1/18 ,  H01R13/504 ,  H05K5/00 ,  H01R12/72

Abstract: A power adapter for powering portable electronic devices is disclosed. The modifications and enhancements to the power adapter can reduce or eliminate the need for adhesives, flexible circuitry, and/or wiring. The power adapter includes multiple guide rails used to guide a circuit board (carrying components) to electrical springs. The electrical springs provide not only an electrical coupling, but also a mechanical coupling. As a result, wiring and/or adhesives is not required. Additionally, a cap is secured to the enclosure through melting part of the cap by, for example, ultrasonic welding without causing damage to the circuit board, as welding location(s) is/are in locations away from the electrical springs and other sensitive components. The power adapter further includes a connector connected to the circuit board. During assembly, the circuit board can pivot in three dimensions during assembly to align the connector with the cap.

公开(公告)号：US20190372265A1

公开(公告)日：2019-12-05

申请号：US16174219

申请日：2018-10-29

Applicant: APPLE INC.

Inventor： Ross C. Heyman ,  Cesar Lozano Villarreal ,  Johnathan D. Simeroth

IPC: H01R13/506 ,  H01R13/66 ,  H01R43/20

Abstract: An enclosure for an electronic device includes a housing having a wall defining a cavity that is configured to receive an electronic assembly therein. The wall includes a distal end having a tongue. A cap is sized to attach to the housing with a corresponding groove that is formed in a perimeter of the cap. A double shear weld joint is formed between the tongue and the groove such that flash from the weld is contained within the enclosure and is not visible on the exterior surface of the enclosure.