公开(公告)号：US08926337B2

公开(公告)日：2015-01-06

申请号：US13722887

申请日：2012-12-20

Applicant: Apple Inc.

Inventor： Edward Siahaan ,  Michael Webb

IPC: H01R11/30 ,  H01R13/46 ,  H01R43/00 ,  H01R13/504 ,  H01R24/60

CPC classification number: H01R13/46 ,  H01R13/504 ,  H01R24/60 ,  H01R43/00 ,  Y10T29/49208

Abstract: An improved method is employed to attach an enclosure to a connector body having relatively small geometry. One or more bonding channels are disposed in the outside surface of the connector body. During assembly of an enclosure over the connector body, a bonding material is distributed within the bonding channels and subsequently cured. The bonding channels and the bonding material are designed to employ capillary wicking to aid in the distribution of the bonding material within the bonding channels.

Abstract translation: 采用改进的方法将外壳连接到具有相对较小几何形状的连接器主体。 一个或多个接合通道设置在连接器主体的外表面中。 在组装封装在连接器主体上方之前，接合材料分布在接合通道内并随后固化。 结合通道和接合材料被设计成使用毛细管芯吸辅助粘合材料在粘合通道内的分布。

公开(公告)号：US20140057496A1

公开(公告)日：2014-02-27

申请号：US13722887

申请日：2012-12-20

Applicant: APPLE INC.

Inventor： Edward Siahaan ,  Michael Webb

IPC: H01R13/46 ,  H01R43/00

CPC classification number: H01R13/46 ,  H01R13/504 ,  H01R24/60 ,  H01R43/00 ,  Y10T29/49208

Abstract: An improved method is employed to attach an enclosure to a connector body having relatively small geometry. One or more bonding channels are disposed in the outside surface of the connector body. During assembly of an enclosure over the connector body, a bonding material is distributed within the bonding channels and subsequently cured. The bonding channels and the bonding material are designed to employ capillary wicking to aid in the distribution of the bonding material within the bonding channels.

Abstract translation: 采用改进的方法将外壳连接到具有相对较小几何形状的连接器主体。 一个或多个接合通道设置在连接器主体的外表面中。 在组装封装在连接器主体上方之前，接合材料分布在接合通道内并随后固化。 结合通道和接合材料被设计成使用毛细管芯吸辅助粘合材料在粘合通道内的分布。