公开(公告)号：US20140308465A1

公开(公告)日：2014-10-16

申请号：US13863264

申请日：2013-04-15

Applicant: APPLE INC.

Inventor： James R. Krogdahl ,  Benjamin J. Pope ,  Dennis R. Pyper ,  Nicholas G.L. Merz ,  Scott A. Myers

IPC: C09J7/02 ,  H05K3/38

CPC classification number: H05K3/386 ,  C09J5/00 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2205/31 ,  H05K3/323 ,  H05K3/361 ,  Y10T156/10 ,  Y10T428/13 ,  Y10T428/31678

Abstract: An electronic device may be provided with electronic device structures such as housing structures, antenna structures, printed circuits, and structures associated with electrical components. The structures may be attached to each other using adhesive. A liquid pressure sensitive adhesive precursor material is deposited onto one or more surfaces of structures to be bonded. Light or heat can be applied to cure the liquid adhesive material and form pressure sensitive adhesive layers. During curing, chemical bonds are formed between the adhesive material and the structures. Assembly equipment may press the structures together to form pressure sensitive adhesive bonds that can be reworked without disturbing the chemically bonded portions of the adhesive material. The pressure sensitive adhesive may include conductive particles for forming conductive paths.

Abstract translation: 电子设备可以设置有诸如壳体结构，天线结构，印刷电路和与电气部件相关联的结构的电子设备结构。 结构可以使用粘合剂彼此附接。 将液体压敏粘合剂前体材料沉积在要结合的结构的一个或多个表面上。 可以施加光或热来固化液体粘合剂材料并形成压敏粘合剂层。 在固化期间，在粘合剂材料和结构之间形成化学键。 组装设备可以将结构压在一起以形成可以重新加工而不干扰粘合剂材料的化学结合部分的压敏粘合剂粘合。 压敏粘合剂可以包括用于形成导电路径的导电颗粒。