公开(公告)号：US11279032B2

公开(公告)日：2022-03-22

申请号：US16844765

申请日：2020-04-09

Applicant: Applied Materials, Inc.

Inventor： Nicholas Michael Bergantz ,  Ali Utku Pehlivan

IPC: B25J9/16

Abstract: A method includes positioning a robot in a plurality of postures in a substrate processing system relative to a fixed location in the substrate processing system and generating sensor data identifying a fixed location relative to the robot in the plurality of postures. The method further includes determining, based on the sensor data, a plurality of error values corresponding to one or more components of the substrate processing system and causing, based on the plurality of error values, performance of one or more corrective actions associated with the one or more components of the substrate processing system.

公开(公告)号：US11813757B2

公开(公告)日：2023-11-14

申请号：US17069431

申请日：2020-10-13

Applicant: APPLIED MATERIALS, INC.

Inventor： Ali Utku Pehlivan ,  Mohsin Waqar ,  Paul Zachary Wirth ,  Todd James Brill

IPC: B25J9/16

CPC classification number: B25J9/1692

Abstract: A method for finding a center of a process kit and/or a process kit ring is provided. An object placed on an end effector is moved past a sensor of a manufacturing system. A first signal indicating a current shape of object is received from the sensor of the manufacturing system. A determination is made whether the first signal corresponds to a second signal indicating a predefined shape for a process kit and/or a process kit carrier. In response to a determination that the first signal corresponds to the second signal, a coordinate correspondence is determined between coordinates of a center of the object and coordinates of a center of the end effector. The determined coordinate correspondence indicates whether a current placement of the object on the end effector satisfies a target placement criterion.

公开(公告)号：US20240051144A1

公开(公告)日：2024-02-15

申请号：US18493735

申请日：2023-10-24

Applicant: APPLIED MATERIALS, INC.

Inventor： Ali Utku Pehlivan ,  Mohsin Waqar ,  Paul Zachary Wirth ,  Todd James Brill

IPC: B25J9/16

CPC classification number: B25J9/1692

Abstract: One or more first signals are obtained. The first signals indicate a current shape of an object placed on an end effector. The one or more first signals are compared to one or more second signals that each indicate a predefined shape for a process component on the end effector. A determination is made of whether a current placement of the object on the end effector satisfies a target placement criterion based on the comparison.

公开(公告)号：US20220111529A1

公开(公告)日：2022-04-14

申请号：US17069431

申请日：2020-10-13

Applicant: APPLIED MATERIALS, INC.

Inventor： Ali Utku Pehlivan ,  Mohsin Waqar ,  Paul Zachary Wirth ,  Todd James Brill

IPC: B25J9/16

Abstract: A method for finding a center of a process kit and/or a process kit ring is provided. An object placed on an end effector is moved past a sensor of a manufacturing system. A first signal indicating a current shape of object is received from the sensor of the manufacturing system. A determination is made whether the first signal corresponds to a second signal indicating a predefined shape for a process kit and/or a process kit carrier. In response to a determination that the first signal corresponds to the second signal, a coordinate correspondence is determined between coordinates of a center of the object and coordinates of a center of the end effector. The determined coordinate correspondence indicates whether a current placement of the object on the end effector satisfies a target placement criterion.

公开(公告)号：US20200324410A1

公开(公告)日：2020-10-15

申请号：US16844765

申请日：2020-04-09

Applicant: Applied Materials, Inc.

Inventor： Nicholas Michael Bergantz ,  Ali Utku Pehlivan

IPC: B25J9/16

Abstract: A method includes positioning a robot in a plurality of postures in a substrate processing system relative to a fixed location in the substrate processing system and generating sensor data identifying a fixed location relative to the robot in the plurality of postures. The method further includes determining, based on the sensor data, a plurality of error values corresponding to one or more components of the substrate processing system and causing, based on the plurality of error values, performance of one or more corrective actions associated with the one or more components of the substrate processing system.