MODULAR HIGH-FREQUENCY SOURCE WITH INTEGRATED GAS DISTRIBUTION

    公开(公告)号:US20190326090A1

    公开(公告)日:2019-10-24

    申请号:US15958562

    申请日:2018-04-20

    Abstract: Embodiments described herein include an applicator frame for a processing chamber. In an embodiment, the applicator frame comprises a first major surface of the applicator frame and a second major surface of the applicator frame opposite the first major surface. In an embodiment, the applicator frame further comprises a through hole, wherein the through hole extends entirely through the applicator frame. In an embodiment, the applicator frame also comprises a lateral channel embedded in the applicator frame. In an embodiment the lateral channel intersects the through hole.

Patent Agency Ranking