公开(公告)号：US11935732B2

公开(公告)日：2024-03-19

申请号：US16251716

申请日：2019-01-18

Applicant: APPLIED MATERIALS, INC.

Inventor： Adolph M. Allen ,  Kirankumar Neelasandra Savandaiah ,  Randal D. Schmieding ,  Vanessa Faune

IPC: H01J37/34 ,  C23C14/34 ,  C23C14/56 ,  H01J37/32

CPC classification number: H01J37/3441 ,  C23C14/34 ,  C23C14/564 ,  H01J37/32651 ,  H01J2237/332

Abstract: A process kit comprises a shield and ring assembly for positioning about a substrate support in a processing chamber to reduce deposition of process deposits on internal chamber components and an overhang edge of the substrate. The shield comprises a cylindrical band having a top wall configured to surround a sputtering target and a sloped portion of a bottom wall having a substantially straight profile with gas conductance holes configured to surround the substrate support. The ring assembly comprises a cover ring having a bulb-shaped protuberance about the periphery of the ring. The bulb-shaped protuberance of the cover ring is able to block a line-of-sight between the gas conductance holes on the shield and an entrance to a chamber body cavity in the processing chamber.