公开(公告)号：US11371159B2

公开(公告)日：2022-06-28

申请号：US16449358

申请日：2019-06-22

Applicant: APPLIED MATERIALS, INC.

Inventor： Eric J Bergman ,  Stuart Crane ,  Tricia A Youngbull ,  Timothy G Stolt

IPC: C25D21/08 ,  B08B17/02 ,  B08B3/08

Abstract: Methods and apparatus for reducing the formation of insoluble deposits in semiconductor electrochemical plating equipment or a surface thereof during electrochemical plating, including: removing electrochemical plating equipment or a surface thereof from an electroplating solution, wherein residual electroplating solution is disposed atop the electrochemical plating equipment or a surface thereof, and wherein the residual electroplating solution has a first pH; contacting the residual electroplating solution with a rinse agent having a second pH similar to the first pH to form a rinsate; and removing the rinsate from the electrochemical plating equipment or a surface thereof.