公开(公告)号：US20170063355A1

公开(公告)日：2017-03-02

申请号：US14838778

申请日：2015-08-28

Applicant: APPLIED MICRO CIRCUITS CORPORATION

Inventor： Rich Thaik ,  Alfred Yeung ,  April Lambert ,  Jeremy Plunkett

IPC: H03K5/1252 ,  H01L23/522 ,  H01L23/525

CPC classification number: H03K5/1252 ,  H01L23/50 ,  H01L23/5223 ,  H01L23/525

Abstract: A semiconductor chip allows for a selected amount of on-die decoupling capacitance to be connected to a very-large-scale integrated circuit (VLSI) system after the circuit design is complete. The semiconductor chip comprises an integrated circuit disposed on a packaging substrate, and a power distribution network that is electrically connectable to the integrated circuit via a programmable connectivity array via the packaging substrate.

Abstract translation: 在电路设计完成之后，半导体芯片允许选定数量的管芯上的去耦电容连接到大规模集成电路（VLSI）系统。 半导体芯片包括设置在封装基板上的集成电路，以及经由可编程连接阵列经由封装基板与集成电路电连接的配电网。