公开(公告)号：US11777265B2

公开(公告)日：2023-10-03

申请号：US17013363

申请日：2020-09-04

Applicant: APTIV TECHNOLOGIES LIMITED

Inventor： Pawel Olek ,  Agnieszka Styczen ,  Olaf Patz ,  Tomasz Slizowski ,  Wojciech Lesniak ,  Marcin Podolak ,  Michal Kuligowski ,  Marek Manterys

IPC: H01R25/00 ,  H01R13/52 ,  H01R43/00 ,  H02G15/117

CPC classification number: H01R25/003 ,  H01R13/5208 ,  H01R43/002 ,  H02G15/117

Abstract: The disclosure relates to a shielded Y-shaped splice connector having a housing that includes a lower body, an upper cover, and three openings arranged to receive three cable fixing devices on the housing. The periphery of the lower body and the periphery of the upper cover are each formed of a flat surface arranged to form the contact surface of the lower body and the upper cover when the housing is assembled.

公开(公告)号：US20210111526A1

公开(公告)日：2021-04-15

申请号：US17013363

申请日：2020-09-04

Applicant: APTIV TECHNOLOGIES LIMITED

Inventor： Pawel Olek ,  Agnieszka Styczen ,  Olaf Patz ,  Tomasz Slizowski ,  Wojciech Lesniak ,  Marcin Podolak ,  Michal Kuligowski ,  Marek Manterys

IPC: H01R25/00 ,  H02G15/117 ,  H01R13/52 ,  H01R43/00

Abstract: The disclosure relates to a shielded Y-shaped splice connector having a housing that includes a lower body, an upper cover, and three openings arranged to receive three cable fixing devices on the housing. The periphery of the lower body and the periphery of the upper cover are each formed of a flat surface arranged to form the contact surface of the lower body and the upper cover when the housing is assembled.