公开(公告)号：US20230084251A1

公开(公告)日：2023-03-16

申请号：US17894163

申请日：2022-08-24

申请人： ARAKAWA CHEMICAL INDUSTRIES, LTD.

发明人： Keisuke Okada ,  Kaito Kuroda ,  MAYU MATSUMOTO ,  Teruaki Sato

IPC分类号： C08L67/02 ,  C08L67/04 ,  C08J5/18 ,  C08J3/05 ,  C08J3/00

摘要： The present disclosure provides a heat sealing aqueous resin composition containing: a rosin resin (A); a biodegradable resin (B) including a resin having a structure of General Formula (1) and/or a resin (b1) having a structure of General Formula (2); and a polyvinyl alcohol (C) in which an average saponification degree is 75 mol % or more and 85 mol % or less, in which a content of the component (b1) is more than 50% by mass when a total content of the component (A) and the component (B) is 100% by mass. —O—(CH2)x—O—CO—(CH2)y—CO—  General Formula (1): (in General Formula (1), x and y may be different from each other, and are integers of 1 or more and 10 or less) —O—(CH2)z—CO—  General Formula (2): (in General Formula (2), z is an integer of 3 or more and 10 or less)