公开(公告)号：US20130174608A1

公开(公告)日：2013-07-11

申请号：US13714915

申请日：2012-12-14

Applicant: ASAHI GLASS COMPANY, LIMITED

Inventor： Toshihiro TAKEUCHI ,  Satoshi FUJIMINE ,  Kazuo YAMADA

IPC: C03C8/24

CPC classification number: C03C8/24 ,  C03C3/14 ,  C03C17/04 ,  H01L51/5246 ,  H05B33/04 ,  H05B33/10

Abstract: A sealing material paste and a process for producing an electronic device are provided, which realize suppressing with good reproducibility generation of bubbles in a sealing layer when a rapid heating-rapid cooling process with a temperature-rising speed of at least 100° C./min is applied to seal two glass substrates together. The sealing material paste, wherein the amount of water is at most 2 volume %, is applied on a sealing region of a glass substrate 2, and such a coating film 8 is fired to form a sealing material layer 7. The glass substrate 2 is laminated with another glass substrate via a sealing material layer 7, and they are heated with a temperature-rising speed of at least 100° C./min to be sealed together.

Abstract translation: 提供一种密封材料糊料和电子器件的制造方法，当以至少100℃的升温速度进行快速加热 - 快速冷却过程时，可以实现在密封层中产生气泡的良好再现性的抑制。 min用于将两块玻璃基板密封在一起。 在玻璃基板2的密封区域上施加水量为2体积％以下的密封材料糊料，并且对该涂膜8进行烧成以形成密封材料层7.玻璃基板2为 通过密封材料层7与另一玻璃基板层叠，并以至少100℃/分钟的升温速度加热，以密封在一起。