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公开(公告)号:US20220341389A1
公开(公告)日:2022-10-27
申请号:US17782730
申请日:2020-12-04
摘要: A bonded body wherein functional base material is attached to object to be bonded. Functional base material and object are bonded with functional base material's end portion covered so operational effect neither lost nor adversely affected by fluid, bonded body has strong bonding property preventing functional base material peeled off due to weather. Peelability allows functional base material repair ease. Functional base material provided on object's curved surface to be bonded to along curved and/or smooth surface of object to be bonded to along smooth surface. Functional base material has peripheral side surface with peripheral distal-most end portion. Peripheral gap part provided between object to be bonded to and functional base material on inside of peripheral distal-most end portion and on side opposing to object to be bonded to. Peripheral gap part filled with holding member extending in laminar fan shape from peripheral side surface along curved and/or smooth surface.
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公开(公告)号:US20210138425A1
公开(公告)日:2021-05-13
申请号:US16617365
申请日:2018-05-24
发明人: Nobuyoshi WATANABE , Hideaki SATO , Yutaka WATANABE , Kenichi YAMAZAKI , Masahiro ASAYAMA , Motofumi TANAKA , Hiroyuki YASUI , Toshiki OSAKO
IPC分类号: B01J19/08 , H05H1/24 , C09J183/08 , C09D123/16 , C09D183/04 , C09D5/24
摘要: An airflow generation device having a first dielectric substrate made from a rubber elastic material, a first electrode on or near by a first surface of the first dielectric substrate, a second electrode on a second surface, and a second dielectric substrate made from a rubber elastic material covering the second electrode. It makes the airflows generated by plasma caused from partial gas near by the first surface through applied voltage into the first electrode and the second electrode, and bonding portions between the first electrode and the second electrode and the first dielectric substrate, bonding portions between the second electrode and the second dielectric substrate, and bonding portions between the first dielectric substrate and the second dielectric substrate are bonded by chemical bonds with chemically crosslinking.
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