公开(公告)号：US20210267306A1

公开(公告)日：2021-09-02

申请号：US17255974

申请日：2018-12-28

Applicant: ASICS Corporation

Inventor： Masanori SAKAGUCHI ,  Seigo NAKAYA ,  Kenta MORIYASU ,  Shingo TAKASHIMA ,  Yuya KOZUKA ,  Tomoki ISHIZASHI ,  Akihisa SUGIFUNE ,  Hiroaki NISHIMURA ,  Takayuki KOGURE

IPC: A43B13/14

Abstract: A shoe sole includes a rear bottom surface part and a toe portion. The rear bottom surface part is formed to extend from a rearfoot portion to a midfoot portion and, when the shoe sole is placed on a flat virtual surface, the rear bottom surface part is in contact with the virtual surface. A height of the toe portion from the virtual surface is set to 170% or greater and 250% or less with respect to a thickness dimension in the rear bottom surface part.