公开(公告)号：US20210298203A1

公开(公告)日：2021-09-23

申请号：US17180001

申请日：2021-02-19

Applicant: ASKEY COMPUTER CORP.

Inventor： CHAO-TSAI CHUNG ,  PO-LIN LIN ,  SHU-TING CHAN

IPC: H05K7/20 ,  H05K5/00

Abstract: An automotive electronic device durable in an automotive environment of at least 95° C. includes a bottom cover, a circuit board and a heatsink casing. The circuit board is installed on the bottom cover. The heatsink casing is assembled with the bottom cover, and covers the circuit board between the heatsink casing and the bottom cover. The heatsink casing includes an outer surface, a plurality of long fins and a plurality of side fins. The long fins are arranged on the outer surface along a first direction. Two adjacent ones of the long fins have a distance at least greater than 8 mm. The side fins are arranged on an edge of the outer surface along a second direction, and connected to one of the long fins.