SEMICONDUCTOR PROCESSING ASSEMBLY AND METHOD FOR TRANSFERRING WAFERS

    公开(公告)号:US20250132181A1

    公开(公告)日:2025-04-24

    申请号:US18915971

    申请日:2024-10-15

    Abstract: A semiconductor processing assembly is disclosed with: a wafer handling robot comprising a plurality of end effectors distributed in substantial vertical direction at an end effector pitch and configured to carry wafers; a wafer boat having boat slots distributed in substantial vertical direction and configured to hold wafers to be loaded at a load pitch; a wafer cassette having cassette slots distributed in substantial vertical direction at a cassette pitch and configured to hold wafers; and an electronic controller for controlling at least the wafer handling robot and having a system memory. By having the end effector pitch substantially equal to the cassette pitch, the electronic controller may be configured and programmed with a program in its system memory to control the semiconductor processing assembly to transfer wafers between the cassette slots of the wafer cassette and the boat slots of the wafer boat.

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