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公开(公告)号：US20230031443A1
公开(公告)日：2023-02-02
申请号：US17788806
申请日：2020-12-08
Applicant: ASML Holding N.V.
Inventor： Matthew LIPSON , Mehmet Ali AKBAS , Tammo UITTERDIJK , Fei ZHAO
IPC: G03F7/20
Abstract: Systems, apparatuses, and methods are provided for manufacturing a wafer clamp having hard burls. The method can include providing a first layer that includes a first surface. The method can further include forming a plurality of burls over the first surface of the first layer. The forming of the plurality of burls can include forming a subset of the plurality of burls to a hardness of greater than about 6.0 gigapascals (GPa).
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