公开(公告)号：US11281113B2

公开(公告)日：2022-03-22

申请号：US17053255

申请日：2019-05-21

Applicant: ASML NETHERLANDS B.V.

Inventor： Danying Li ,  Chi-Hsiang Fan ,  Abdalmohsen Elmalk ,  Youping Zhang ,  Jay Jianhui Chen ,  Kui-Jun Huang

IPC: G03F7/20

Abstract: A method for determining a stack configuration for a substrate subjected to a patterning process. The method includes obtaining (i) measurement data of a stack configuration with location information on a printed substrate, (ii) a substrate model configured to predict a stack characteristic based on a location of the substrate, and (iii) a stack map including a plurality of stack configurations based on the substrate model. The method iteratively determines values of model parameters of the substrate model based on a fitting between the measurement data and the plurality of stack configurations of the stack map, and predicts an optimum stack configuration at a particular location based on the substrate model using the values of the model parameters.