Method for controlling a manufacturing process and associated apparatuses

    公开(公告)号:US11187994B2

    公开(公告)日:2021-11-30

    申请号:US17264023

    申请日:2019-07-03

    Abstract: A method for controlling a manufacturing process for manufacturing semiconductor devices, the method including: obtaining performance data indicative of the performance of the manufacturing process, the performance data including values for a performance parameter across a substrate subject to the manufacturing process; and determining a process correction for the manufacturing process based on the performance data and at least one control characteristic related to a dynamic behavior of one or more control parameters of the manufacturing process, wherein the determining is further based on an expected stability of the manufacturing process when applying the process correction.

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