ACTIVE LEARNING TO IMPROVE WAFER DEFECT CLASSIFICATION

    公开(公告)号:US20250117921A1

    公开(公告)日:2025-04-10

    申请号:US18832094

    申请日:2023-01-19

    Abstract: Systems and methods for training a machine learning model to classify defects with utility-function-based active learning are described. In one embodiment, one or more non-transitory, machine-readable mediums are configured to cause a processor to at least determine a utility function value for unclassified measurement images, based on a machine learning model, wherein the machine learning model is trained using a pool of labeled measurement images. Based on a determination that the utility function value for a given unclassified measurement image is less than a threshold value, the unclassified measurement image is output for classification without the use of the machine learning model. The unclassified measurement images classified via the classification without the use of the machine learning model are added to the pool of labeled measurement images. The machine learning model is trained based on the measurement images classified via the classification without the use of the machine learning model.

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