公开(公告)号：US20210132508A1

公开(公告)日：2021-05-06

申请号：US16640088

申请日：2018-07-30

Applicant: ASML NETHERLANDS B.V.

Inventor： Cyrus Emil TABERY ,  Hakki Ergün CEKLI ,  Simon, Hendreik Celine VAN GORP ,  Chenxi Lin

IPC: G03F7/20 ,  H01L21/66

Abstract: A method for determining a control parameter for an apparatus used in a semiconductor manufacturing process, the method including: obtaining performance data associated with a substrate subject to the semiconductor manufacturing process; obtaining die specification data including values of an expected yield of one or more dies on the substrate based on the performance data and/or a specification for the performance data; and determining the control parameter in dependence on the performance data and the die specification data Advantageously, the efficiency and/or accuracy of processes is improved by determining how to perform the processes in dependence on dies within specification.