公开(公告)号：US20210193537A1

公开(公告)日：2021-06-24

申请号：US17097063

申请日：2020-11-13

Applicant: ASML Netherlands B.V.

Inventor： Chien-Hung CHOU ,  Wen-Tin TAI

IPC: H01L21/66 ,  G05B19/418 ,  G01N21/95

Abstract: Method and machine utilizes the real-time recipe to perform weak point inspection on a series of wafers during the fabrication of integrated circuits. Each real-time recipe essentially corresponds to a practical fabrication history of a wafer to be examined and/or the examination results of at least one examined wafer of same “lot”. Therefore, different wafers can be examined by using different recipes where each recipe corresponds to a specific condition of a wafer to be examined, even these wafers are received by a machine for examining at the same time.