公开(公告)号：US20250155940A1

公开(公告)日：2025-05-15

申请号：US18601354

申请日：2024-03-11

Applicant: ASUSTEK COMPUTER INC.

Inventor： Kuan-Yu LIN

IPC: G06F1/16 ,  G06F3/0354

Abstract: A mold assembly for assembling a touch module in a housing is provided. The touch module comprises a carrier, a circuit board, and a touch film. The housing has an opening corresponding to the touch module, and there has a plurality of positioning elements and a plurality of securing elements around the opening. The mold assembly comprises a base, a first frame, and a second frame. The base has an upper surface with a concave corresponding to the carrier. The first frame is for detachably disposed on the first surface and has a first opening correspond to the circuit board. The second frame is for detachably disposed on the first surface and has a second opening corresponding to the touch film. An assembling method using the mold assembly is also provided.